> Handmade sharpening and grinding: Pure manual cutting edge grinding

> Real gold plating process : Standardized 5UM nickel layer process real gold plating molecular surface treatment anti-oxygen and anti-corrosion.

> Special grade 4A material : Adopt 0.1mm imported AAAA steel, soft and tough, strong heat and wear resistance.

> Non-slip fine lines design : 8mm diameter, comfortable grip, ergonomic design.

> Double handle : Adopt 0.1mm imported AAAA steel, soft and tough, strong heat and wear resistance.

> Crescent Knife for iPhone A8 A9 A10 A11 A12 CPU BGA chip.

> Crooked Knife Disassemble Cleaning Pry tool for mobile phone motherboard sealant glue.

> UV Glue Cleaning Tool and crooked shovel Knife for Removing the motherboard sealant glue.

> Solder Paste Scraping Knife for cell Phone BGA Repair and UV Glue Cleaning Tool.

Blade Description:

-IC/edge rubber removal: 21/16/22/23/24/25/26/29/30/34

-CPU /motherboard layered: 01/02/03/04/11/18/19/28

-Remove hard disk/baseband: 06/09/12/14/20/32/33

-Shovel glue/remove glue: 05/07/08/10/27/13/15/17/30