MECHANIC XG-50 183 Degree Soldering Ball Paste
Tk. 260
> Material: Plastic+solder paste.
> Color: As picture shown
> Type: XG-50 , 35g
> Microns: 25-45um.
> Application: for BGA motherboard soldering iron station flux cream.
> Function: Mobile phone chips repair, computer and digital service industries,...
> Material: Plastic+solder paste.
> Color: As picture shown
> Type: XG-50 , 35g
> Microns: 25-45um.
> Application: for BGA motherboard soldering iron station flux cream.
> Function: Mobile phone chips repair, computer and digital service industries, high-precision circuit board SMT soldering, BGA welding process, etc.
> Hi-Preformance.
> Storage Condition: 0-10°c.
