Features:

1.Panel tilt design is more convenient.

2.Soldering iron seat tops to stabilize space.

3.Microcomputer control,warming-up quickly.

4.PID technology to enhance temperature stability.

5.Adjust the airflow and temperature control rotation easily.

6.Dual LCD digital displays to show precision temperature.

7.Suitable for SOIC, CHIP, QFP, PLCC, B-G-A and temperature-sensitive components.

8.Fits for heating shrink, drying, lacquer removal, viscidity removal, ice-out, pre-heating and glue soldering.

Specification:

Material: Stainless steel+ABS Plastic

Voltage: AC 110V/220V

Power: 700W

Work Temperature: 0-40°C

Temperature Stability: ±2°C (static state)

Airflow Type: Brushless Fan (gentle wind)

Airflow volume: 120L/min

Soldering Temperature: 200 - 480°C

Display: Double LCD

Temperature control method: Microcomputer PID

10 minutes sleep: Yes

Digital correction temperature: Yes

Airgun automatic start/stop: Yes

Hot and cold air switching: Yes

Machine

Rated voltage: 240V/230V/220V/110V ±10% 50Hz/60Hz

Whole device power: ≤740W

Work environment: 0~40°C

Storage temperature: -20~80°C

Storage Humidity: 35%~45%

Hot air gun part

Temperature range: 100°C~480

Temperature stability: ±2°C（Static state）

Airflow type: Brushless fan gentle wind 

Airflow: 120L/min (MAX)

Soldering iron part

Work voltage: 26V±10% 50Hz/60

Temperature range: 200°C~480°C

Temperature stability: ±2°C (Static state)

Tip-to-ground impedance: ＜2Ω

Tip-to-ground voltage: ＜2mV